• Improved thermal performance with emphasis on Intel® and AMD® latest and upcoming processors: the HD is Socket LGA2011 (Intel®) and "Bulldozer" (AMD®) ready.
• Reduced flow restriction compared to the Apogee XT Rev2.
• Innovative features, with the introduction of the multi-port connectivity: two more outlet ports have been added for dramatic flow rate improvements in multiple waterblock configurations and when used with the new MCRx20 Drive Rev3 radiators that now also include two additional inlet ports (3 total); read more about "Flow Parallelization" in the section below including examples and in-depth explanations.
• Improved thermal performance out of the box with the inclusion of high performance PK1 thermal compound
• Cosmetic appeal: the Apogee HD is now available in two colors, Classic black or Fashionable white to match high-end case offerings from NZXT™, Silverstone®, Thermaltake and many others.
• Reduced cost of ownership.

Modern CPUs generate a lot of heat (up to and sometimes higher than 200 W), which is transferred through a very small die surface (the die is the actual silicon, and it is usually protected by a metallic plate called a heat spreader or IHS). Among other things, what it means in practical terms is that higher flow rates will have relatively more impact on the CPU operating temperature than on any other devices. For this reason, and in most configurations, the Apogee™ HD CPU waterblock will preferably always be connected in series with the main line, so it can benefit from the highest possible flow rate.