Enzotech BMR-C1 High Profile Ramsinks
Enzotech's BMR-C1 BGA Ramsinks are designed to offer exceptional heat dissipation for BGA memory chips on video cards and motherboards. BMR-C1 RAM sinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The BMR-C1 RAM Sink is far superior to traditional heat sinks currently found on the market and provides the best thermal conductivity available to dissipate heat from RAM in your system.
Features:
ATI® & NVIDIA® Compatible
Pure forged copper
Easy installation by using 3M™ 8815 Thermal Tape
Multipack - Eight (8) piece set
Specifications:
Dimensions (mm) 14(L) mm x 14mm(W) x 14mm(H)
Material C1100 Forged Copper
Weight 7g (Each)
Thermal Adhesive 3M™ 8815 Thermal Tape
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