The Liquid MetalPad is the innovation in the cooling of processors from game consoles with a heat conduction pad!
The Coollaboratory Liquid MetalPad is the first heat conduction pad, which is composed of 100% metal and melts with just less heating (BurnIn-process), then it confects its superior heat transfer. It dissipates the heat fast and efficiently and needn´t hide from the best heat conduction paste. The simple, clean and fast installation turns the Liquid MetalPad into the ultimate heat conduction medium for high performance processors.
The Liquid MetalPad can be used with all on the cooling market commercially available materials, for instance aluminum or copper! It doesn´t age and doesn´t have to exchange regular. The Coollaboratory Liquid MetalPad is certainly RoHS conformable and absolute nontoxic.
The Coollaboratory Liquid MetalPad for High-Performance CPUs is delivered in a transparent blister-package with a detailed manual and contains two Liquid MetalPads (ca. 67x50mm). Additionally there is a cleaning set with two cleaning tissues for removal or cleaning of the contact area before and after using the Liquid MetalPad included.
Weight: 0.04 kg
Material: 100% liquid metal alloy
Compatibility: All materials, all Intel and AMD (TR4, Threadripper included) CPU's.
Electrically conductive: Yes
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