This specially adapted thermal pad prevents damage, chipping or short circuiting of the chipset when mounting a water block or cooler. It is suitable for all chipsets with a core in the middle without a frame. The pad also conducts heat very well, improving cooling performance.
Specifications:
Self adhesive
Thickness: 1.0mm
Dimensions: 35x35mm
Cut-out hole dimensions: 15x15mm
Manufacturer:
HighFlow
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