With a material thickness of half a millimeter and an adhesive coating on one side, this thermal pad is ideal for use with the ramplex. The material is easy to form and adapts perfectly to the surface of irregularly shaped components.
Dimensions: approx. 120 x 20 x 0.5 mm
Maximum air gap to be bridged: 0.5 mm
Thermal conductivity: 3.5 W/mK
electrically non-conductive
Scope of delivery: 1x thermal pad
Manufacturer:
Aqua-Computer
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