"Thermal compound products are the weakest link in transferring heat between component and heat sink. Our goal is to eliminate this weak point. We had the idea to do this by using high performance thermal compound products for several years now", says Eike Salow, computer scientist and founder of Thermal Grizzly.
"We know about the very high expectations of the evergrowing overclocker scene regarding high performance cooling solutions - and we strive to exceed them. To emphasize this claim, we worked closely with extreme overclocker Roman "der8auer" Hartung during development."